Factors Governing Tin Whisker Growth | Buch

Um unseren Shop nutzen zu können, müssen Sie Javascript in Ihrem Browser aktivieren.

Cover: 9783319004693 | Factors Governing Tin Whisker Growth | Erika R Crandall | Buch | xii

Dekorationsartikel gehören nicht zum Leistungsumfang.

Sprache: Englisch

99,95 €*

inkl. MwSt.

Versandkostenfrei per Post / DHL

Lieferzeit 2-3 Wochen

Sie können kein Produkt in den Warenkorb legen, da Javascript und technisch notwendige Cookies aktiviert sein müssen.

Kategorien:

Der Artikel ist nicht in deutscher Sprache verfasst.
Die Sprache der Produktbeschreibung und Details kann in Englisch angegeben sein. Sollten Sie Verständnisprobleme haben, wenden Sie sich gerne an uns.

Beschreibung

Tin (Sn) whiskers are electrically conductive, single crystal eruptions that grow from Sn film surfaces. Their high aspect ratio presents reliability problems for the electronics industry due to bridging and metal arcing, leading to malfunctions and catastrophic failures in many electronic systems (including satellite and defense sectors). Due to legislation in the EU, Japan, and the U.S., mandating a gradual shift from lead (Pb)-based to lead-free solders and board finishes, there has been a reemergence of Sn whiskers. Continuing reports of Sn whisker induced failures coupled with the lack of an industry-accepted understanding of whisker growth and/or test methods to identify whisker prone products has made pure/high Sn substitutes a risky proposition in high reliability systems.
This thesis is designed to clarify and control the fundamental mechanisms that govern whisker formation. The research focuses on reproducible "laboratory" created whiskers under a variety of rigorously controlled environmental factors such as film thickness, film stress, substrate material, gas environment, and humidity exposure, which are known to play a significant role in whisker production. The ultimate question of how to impede and/or prevent whisker growth is also addressed and shows that whisker prevention is possible via hard metal capping films, which are impenetrable by whiskers.

Über den Autor

Erika Crandall received her Ph.D. from the Department of Physics at Auburn University under supervisor Michael Bozack. She was awarded the 2012 Outstanding Doctoral Student Award from Auburn University, and was the inaugural recipient of the IEEE International Holm Conference Young Investigator Award for her paper "Whisker Growth Under Controlled Humidity Exposure."

Zusammenfassung

Nominated by Auburn University, USA, as an outstanding Ph.D. thesis

Identifies and defines several factors that govern whisker formation and growth

Describes whisker prevention using a variety of impenetrable topside hard metal films which prevent Sn whiskers from penetrating through capping barriers

Studies why particular topside metal films prevent whisker growth while others do not

Includes supplementary material: [...]

Inhaltsverzeichnis

Whiskers and Their Role in Component Reliability.- Film/Substrate Effects on Whisker Growth.- Environmental Effects of Whisker Growth.- Whisker Mitigation and Prevention.- Conclusions.

Details

Erscheinungsjahr:	2013
Fachbereich:	Nachrichtentechnik
Genre:	Technik
Rubrik:	Naturwissenschaften & Technik
Medium:	Buch
Seiten:	148
Reihe:	Springer Theses
Inhalt:	xii 136 S. 27 s/w Illustr. 65 farbige Illustr. 136 p. 92 illus. 65 illus. in color.
ISBN-13:	9783319004693
ISBN-10:	3319004697
Sprache:	Englisch
Herstellernummer:	86207626
Ausstattung / Beilage:	HC runder Rücken kaschiert
Einband:	Gebunden
Autor:	Crandall, Erika R
Auflage:	2013
Hersteller:	Springer International Publishing Springer International Publishing AG Springer Theses
Maße:	241 x 160 x 14 mm
Von/Mit:	Erika R Crandall
Erscheinungsdatum:	20.09.2013
Gewicht:	0,395 kg

preigu-id: 105686597