Dry Etching Technology for Semiconductors

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Sprache: Englisch

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Beschreibung

This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.

Über den Autor

Kazuo Nojiri is a CTO of Lam Research Japan. He has 37 years of experience in semiconductor industry. Prior to joining Lam in 2000, he worked for Hitachi Ltd. for 25 years, where he held numerous management positions for Dry Etching and Device Integration. He is also known as a pioneer in the research field of charging damage. He published 38 technical papers and 3 books. In 1984 he was awarded the Okouchi Memorial Prize for the development of ECR plasma etching technology.

Zusammenfassung

Provides a comprehensive, systematic guide to dry etching technologies, from basics to latest technologies

Enables beginners to understand the mechanisms of dry etching, without complexities of numerical formulas/equations

Describes etching processes for all materials which are used in semiconductor devices, explains key etching parameters for each material, and explains why a particular plasma source and etching gas chemistry is used for each material

Discusses the device manufacturing flow and explains in which part of device manufacturing dry etching is actually used

Describes the types and plasma generation mechanism of etching equipment which are actually used in semiconductor fabs, such as CCP (Capacitively Coupled Plasma), Magnetron RIE (Magnetron Reactive Ion Etching), ECR (Electron Cyclotron Resonance) Plasma, and ICP (Inductively Coupled Plasma)

Includes supplementary material: [...]

Inhaltsverzeichnis

Contribution of Dry Etching Technology to Progress of Semiconductor Integrated Circuit.- Mechanism of Dry Etching.- Dry Etching of Various Materials.- Dry Etching Equipments.- Dry Etching Damage.- Latest Dry Etching Technologies.- Future Challenges and Outlook for Dry Etching Technology.

Details

Erscheinungsjahr:	2014
Fachbereich:	Nachrichtentechnik
Genre:	Technik
Rubrik:	Naturwissenschaften & Technik
Medium:	Buch
Seiten:	132
Inhalt:	xiii 116 S. 123 s/w Illustr. 116 p. 123 illus.
ISBN-13:	9783319102948
ISBN-10:	331910294X
Sprache:	Englisch
Herstellernummer:	86353428
Ausstattung / Beilage:	HC runder Rücken kaschiert
Einband:	Gebunden
Autor:	Nojiri, Kazuo
Auflage:	2015
Hersteller:	Springer International Publishing Springer International Publishing AG
Maße:	241 x 160 x 13 mm
Von/Mit:	Kazuo Nojiri
Erscheinungsdatum:	03.11.2014
Gewicht:	0,371 kg

preigu-id: 105196580