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Thermal Computations for Electronics
Conductive, Radiative, and Convective Air Cooling
Taschenbuch von Gordon N Ellison
Sprache: Englisch

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Beschreibung

The flavor and organization of the first edition has been retained whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer.

The flavor and organization of the first edition has been retained whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer.

Über den Autor
Gordon N. Ellison has a BA in Physics from the University of California at Los Angeles (UCLA) and an MA in Physics from the University of Southern California (USC). His career in thermal engineering includes twelve years as a Technical Specialist at NCR and eighteen years at Tektronix, Inc., retiring from the latter as a Tektronix Fellow. Over the last fifteen years Ellison has been an independent consultant and has also taught the course, Thermal Analysis for Electronics, at Portland State University, Oregon. He has also designed and written several thermal analysis computer codes.
Inhaltsverzeichnis
Introduction. Thermodynamics of airflow. Airflow I: Forced flow in systems. Airflow II: Forced flow in ducts, extrusions, and pin fin arrays. Airflow III: Buoyancy driven draft. Forced convective heat transfer I: Components. Forced convective heat transfer II: Ducts, extrusions, and pin fin arrays. Natural convection heat transfer I: Plates. Natural convection heat transfer II: Heat sinks. Thermal radiation heat transfer. Conduction I: Basics. Conduction II: Spreading resistance. Additional mathematical methods. Appendix i: Physical properties of dry air at atmospheric pressure. Appendix ii: Radiation emissivity at room temperature. Appendix iii: Thermal conductivity of some common electronic packaging materials. Appendix iv: Some properties of Bessel functions. Appendix v: Some properties of the Dirac delta function. Appendix vi: Fourier coefficients for a rectangular source. Appendix vii: Derivation of the Green's function properties for the spreading problem of a rectangular source and substrate - method A. Appendix viii: Derivation of the Green's function properties for the spreading problem of a rectangular source and substrate - method B. Appendix ix: Proof of reciprocity for the steady-state Green's function. Proof of reciprocity for the three-dimensional, time-dependent Green's function. Appendix x: Finned surface to flat plate h conversion. Appendix xi: Some conversion factors. Appendix xii: Altitude effects for fan driven airflow and forced convection cooled enclosures.Appendix xiii: Altitude effects for buoyancy driven airflow and natural convection cooled enclosures. Bibliography. Index.
Details
Erscheinungsjahr: 2022
Fachbereich: Fertigungstechnik
Genre: Technik
Rubrik: Naturwissenschaften & Technik
Medium: Taschenbuch
ISBN-13: 9781032336312
ISBN-10: 1032336315
Sprache: Englisch
Einband: Kartoniert / Broschiert
Autor: Ellison, Gordon N
Auflage: 2nd edition
Hersteller: CRC Press
Maße: 251 x 175 x 25 mm
Von/Mit: Gordon N Ellison
Erscheinungsdatum: 13.06.2022
Gewicht: 0,703 kg
Artikel-ID: 128436581
Über den Autor
Gordon N. Ellison has a BA in Physics from the University of California at Los Angeles (UCLA) and an MA in Physics from the University of Southern California (USC). His career in thermal engineering includes twelve years as a Technical Specialist at NCR and eighteen years at Tektronix, Inc., retiring from the latter as a Tektronix Fellow. Over the last fifteen years Ellison has been an independent consultant and has also taught the course, Thermal Analysis for Electronics, at Portland State University, Oregon. He has also designed and written several thermal analysis computer codes.
Inhaltsverzeichnis
Introduction. Thermodynamics of airflow. Airflow I: Forced flow in systems. Airflow II: Forced flow in ducts, extrusions, and pin fin arrays. Airflow III: Buoyancy driven draft. Forced convective heat transfer I: Components. Forced convective heat transfer II: Ducts, extrusions, and pin fin arrays. Natural convection heat transfer I: Plates. Natural convection heat transfer II: Heat sinks. Thermal radiation heat transfer. Conduction I: Basics. Conduction II: Spreading resistance. Additional mathematical methods. Appendix i: Physical properties of dry air at atmospheric pressure. Appendix ii: Radiation emissivity at room temperature. Appendix iii: Thermal conductivity of some common electronic packaging materials. Appendix iv: Some properties of Bessel functions. Appendix v: Some properties of the Dirac delta function. Appendix vi: Fourier coefficients for a rectangular source. Appendix vii: Derivation of the Green's function properties for the spreading problem of a rectangular source and substrate - method A. Appendix viii: Derivation of the Green's function properties for the spreading problem of a rectangular source and substrate - method B. Appendix ix: Proof of reciprocity for the steady-state Green's function. Proof of reciprocity for the three-dimensional, time-dependent Green's function. Appendix x: Finned surface to flat plate h conversion. Appendix xi: Some conversion factors. Appendix xii: Altitude effects for fan driven airflow and forced convection cooled enclosures.Appendix xiii: Altitude effects for buoyancy driven airflow and natural convection cooled enclosures. Bibliography. Index.
Details
Erscheinungsjahr: 2022
Fachbereich: Fertigungstechnik
Genre: Technik
Rubrik: Naturwissenschaften & Technik
Medium: Taschenbuch
ISBN-13: 9781032336312
ISBN-10: 1032336315
Sprache: Englisch
Einband: Kartoniert / Broschiert
Autor: Ellison, Gordon N
Auflage: 2nd edition
Hersteller: CRC Press
Maße: 251 x 175 x 25 mm
Von/Mit: Gordon N Ellison
Erscheinungsdatum: 13.06.2022
Gewicht: 0,703 kg
Artikel-ID: 128436581
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