Lian Zhang: Silicon Microchannel Heat Sinks

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Cover: 9783540401810 | Silicon Microchannel Heat Sinks | Theories and Phenomena | Buch | IX

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Sprache: Englisch

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Beschreibung

There is significant current interest in new technologies for IC (Integrated Circuit) cooling, driven by the rapid increase in power densities in ICs and the trend towards high-density electronic packaging for applications throughout civilian and military markets. In accordance with Moore's Law, the number of transistors on 6 Intel Pentium microprocessors has increased from 7.5 x10 in 1997 (Pentium II) to 6 55 x10 in 2002 (Pentium 4). Considering the rapid increase in the integration density, thermal management must be well designed to ensure proper functionality of these high-speed, high-power chips. Forced air convection has been traditionally used to remove the heat through a finned heat sink and fan module. 2 Currently, with 82 W power dissipation rate, approximately 62 W/cm heat flux, from a Pentium 4 processor with 3.06 GHz core frequency, the noise generated from high rotating speed fans is approaching the limit of acceptable level for humans. However, the power dissipation from a single cost-performance chip is 2 expected to exceed 100 W/cm by the year 2005, when the air cooling has to be replaced by new cooling technologies. Among alternative cooling methods, the two-phase microchannel heat sink is one of the most promising solutions. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of such a device.

Zusammenfassung

Heat sinks is a topic related to functioning of electronic microdevices

This topic is systematically presented in this book for the first time

Includes supplementary material: [...]

Inhaltsverzeichnis

1 Introduction.- 2 Two-phase Microchannel Heat Sinks: Problems and Challenges.- 3 A Thermal Experimental System with Freestanding Microchannels.- 4 Measurements and Modeling of Two-phase Flow in Microchannels.- 5 Boiling Regimes and Transient Signals Associated with the Phase Change.- 6 Enhanced Nucleate Boiling in Microchannels.- 7 Conclusions.- Appendix A: Process Flow Chart for Single-channel Devices with Combined Heater and Thermometers.- Appendix B: Process Flow Chart for Single-channel Devices with Separate Heater and Thermometers.- References.

Details

Erscheinungsjahr:	2003
Fachbereich:	Elektrizität/Magnetismus/Optik
Genre:	Physik
Rubrik:	Naturwissenschaften & Technik
Medium:	Buch
Seiten:	156
Reihe:	Microtechnology and MEMS
Inhalt:	ix 141 S. 92 s/w Illustr. 4 farbige Illustr. 141 p. 96 illus. 4 illus. in color.
ISBN-13:	9783540401810
ISBN-10:	3540401814
Sprache:	Englisch
Ausstattung / Beilage:	HC runder Rücken kaschiert
Einband:	Gebunden
Autor:	Zhang, Lian Kenny, Thomas W. Goodson, Kenneth E.
Auflage:	2004
Hersteller:	Springer-Verlag GmbH Springer Berlin Heidelberg Microtechnology and MEMS
Maße:	241 x 160 x 15 mm
Von/Mit:	Lian Zhang (u. a.)
Erscheinungsdatum:	26.11.2003
Gewicht:	0,435 kg