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Aktuell und didaktisch ausgereift, bietet der Band Anwendern und fortgeschrittenen Studierenden einen ausgezeichneten Zugang zu den Themenbereichen MEMS und Mikrosysteme. Berücksichtigt werden sowohl Aspekte der Elektrik und Elektronik als auch die mechanische Seite der MEMS.
Aktuell und didaktisch ausgereift, bietet der Band Anwendern und fortgeschrittenen Studierenden einen ausgezeichneten Zugang zu den Themenbereichen MEMS und Mikrosysteme. Berücksichtigt werden sowohl Aspekte der Elektrik und Elektronik als auch die mechanische Seite der MEMS.
Über den Autor
Tai-Ran Hsu, PhD, is a Professor in the Department of Mechanical and Aerospace Engineering, San Jose State University, California. Dr. Hsu is the author of the earlier edition of this book, which is considered one of the bestselling textbooks on the subject of MEMS.
Inhaltsverzeichnis
Preface.
Chapter 1: Overview of MEMS and Microsystems.
Problems.
Chapter 2: Working Principles of Microsystems.
Problems.
Chapter 3: Engineering Science for Microsystems Design and Fabrication.
Problems.
Chapter 4: Engineering Mechanics for Microsystems Design.
Problems.
Chapter 5: Thermofluid Engineering and Microsystems Design.
Problems.
Chapter 6: Scaling Laws in Miniaturization.
Problems.
Chapter 7: Materials for MEMS and Microsystems.
Problems.
Chapter 8: Microsystems Fabrication Processes.
Problems.
Chapter 9: Overview of Micromanufacturing.
Problems.
Chapter 10: Microsystem Design.
Problems.
Chapter 11: Assembly, Packaging and Testing of Microsystems.
Problems.
Chapter 12: Introduction to Nanoscale Engineering.
Problems.
Bibliography.
Index.
Chapter 1: Overview of MEMS and Microsystems.
Problems.
Chapter 2: Working Principles of Microsystems.
Problems.
Chapter 3: Engineering Science for Microsystems Design and Fabrication.
Problems.
Chapter 4: Engineering Mechanics for Microsystems Design.
Problems.
Chapter 5: Thermofluid Engineering and Microsystems Design.
Problems.
Chapter 6: Scaling Laws in Miniaturization.
Problems.
Chapter 7: Materials for MEMS and Microsystems.
Problems.
Chapter 8: Microsystems Fabrication Processes.
Problems.
Chapter 9: Overview of Micromanufacturing.
Problems.
Chapter 10: Microsystem Design.
Problems.
Chapter 11: Assembly, Packaging and Testing of Microsystems.
Problems.
Chapter 12: Introduction to Nanoscale Engineering.
Problems.
Bibliography.
Index.
Details
Erscheinungsjahr: | 2008 |
---|---|
Fachbereich: | Nachrichtentechnik |
Genre: | Technik |
Rubrik: | Naturwissenschaften & Technik |
Medium: | Buch |
Seiten: | 576 |
Inhalt: | 576 S. |
ISBN-13: | 9780470083017 |
ISBN-10: | 0470083018 |
Sprache: | Englisch |
Einband: | Gebunden |
Autor: | Hsu, Tai-Ran |
Auflage: | 2nd edition |
Hersteller: |
Wiley
John Wiley & Sons |
Maße: | 241 x 196 x 35 mm |
Von/Mit: | Tai-Ran Hsu |
Erscheinungsdatum: | 01.03.2008 |
Gewicht: | 1,261 kg |
Über den Autor
Tai-Ran Hsu, PhD, is a Professor in the Department of Mechanical and Aerospace Engineering, San Jose State University, California. Dr. Hsu is the author of the earlier edition of this book, which is considered one of the bestselling textbooks on the subject of MEMS.
Inhaltsverzeichnis
Preface.
Chapter 1: Overview of MEMS and Microsystems.
Problems.
Chapter 2: Working Principles of Microsystems.
Problems.
Chapter 3: Engineering Science for Microsystems Design and Fabrication.
Problems.
Chapter 4: Engineering Mechanics for Microsystems Design.
Problems.
Chapter 5: Thermofluid Engineering and Microsystems Design.
Problems.
Chapter 6: Scaling Laws in Miniaturization.
Problems.
Chapter 7: Materials for MEMS and Microsystems.
Problems.
Chapter 8: Microsystems Fabrication Processes.
Problems.
Chapter 9: Overview of Micromanufacturing.
Problems.
Chapter 10: Microsystem Design.
Problems.
Chapter 11: Assembly, Packaging and Testing of Microsystems.
Problems.
Chapter 12: Introduction to Nanoscale Engineering.
Problems.
Bibliography.
Index.
Chapter 1: Overview of MEMS and Microsystems.
Problems.
Chapter 2: Working Principles of Microsystems.
Problems.
Chapter 3: Engineering Science for Microsystems Design and Fabrication.
Problems.
Chapter 4: Engineering Mechanics for Microsystems Design.
Problems.
Chapter 5: Thermofluid Engineering and Microsystems Design.
Problems.
Chapter 6: Scaling Laws in Miniaturization.
Problems.
Chapter 7: Materials for MEMS and Microsystems.
Problems.
Chapter 8: Microsystems Fabrication Processes.
Problems.
Chapter 9: Overview of Micromanufacturing.
Problems.
Chapter 10: Microsystem Design.
Problems.
Chapter 11: Assembly, Packaging and Testing of Microsystems.
Problems.
Chapter 12: Introduction to Nanoscale Engineering.
Problems.
Bibliography.
Index.
Details
Erscheinungsjahr: | 2008 |
---|---|
Fachbereich: | Nachrichtentechnik |
Genre: | Technik |
Rubrik: | Naturwissenschaften & Technik |
Medium: | Buch |
Seiten: | 576 |
Inhalt: | 576 S. |
ISBN-13: | 9780470083017 |
ISBN-10: | 0470083018 |
Sprache: | Englisch |
Einband: | Gebunden |
Autor: | Hsu, Tai-Ran |
Auflage: | 2nd edition |
Hersteller: |
Wiley
John Wiley & Sons |
Maße: | 241 x 196 x 35 mm |
Von/Mit: | Tai-Ran Hsu |
Erscheinungsdatum: | 01.03.2008 |
Gewicht: | 1,261 kg |
Warnhinweis