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and Journal of Nanomaterials, and an editorial board member of Nanoscience & Nanotechnology-Asia. Dr. Lu also serves as an adjunct professor in Huazhong University of Science and Technology, and SIAT (Shenzhen Institute of Advanced Technologies), Chinese Academy of Science. Dr. Lu has more 15 years of experience in electronic packaging and is an expert in electronic packaging materials and processing.
Professor C.P. Wong is with the School of Materials Sciences and Engineering at Georgia Tech (GT) and also is the Dean of Engineering, The Chinese University of Hong Kong. Prior to joining GT, he was with AT&T Bell Laboratories for many years and was an AT&T Bell Labs Fellow. His research interests focus on the areas of material and process for electronic, photonic, MEMS, sensors, and energy harvesting and storage. He has published over 1,000 technical papers, 12 books and holds over 65 US Patents. He is a member of the US National Academy of Engineering and a Foreign Academician of the Chinese Academy of Engineering.
Provides a comprehensive summary of the most recent advances in materials development for advanced packaging
Covers emerging technologies such as digital health, bio-medical and nano materials and process, and microelectronic and optoelectronic packaging
Contains a balanced number of chapter authors from academia and industry, who are leaders in their respective fields
Erscheinungsjahr: | 2018 |
---|---|
Fachbereich: | Nachrichtentechnik |
Genre: | Technik |
Rubrik: | Naturwissenschaften & Technik |
Medium: | Taschenbuch |
Inhalt: |
xvi
969 S. 260 s/w Illustr. 440 farbige Illustr. 969 p. 700 illus. 440 illus. in color. |
ISBN-13: | 9783319832098 |
ISBN-10: | 3319832093 |
Sprache: | Englisch |
Ausstattung / Beilage: | Paperback |
Einband: | Kartoniert / Broschiert |
Redaktion: |
Wong, C. P.
Lu, Daniel |
Herausgeber: | Daniel Lu/C P Wong |
Auflage: | Softcover reprint of the original 2nd ed. 2017 |
Hersteller: |
Springer International Publishing
Springer International Publishing AG |
Maße: | 235 x 155 x 53 mm |
Von/Mit: | C. P. Wong (u. a.) |
Erscheinungsdatum: | 08.06.2018 |
Gewicht: | 1,463 kg |
and Journal of Nanomaterials, and an editorial board member of Nanoscience & Nanotechnology-Asia. Dr. Lu also serves as an adjunct professor in Huazhong University of Science and Technology, and SIAT (Shenzhen Institute of Advanced Technologies), Chinese Academy of Science. Dr. Lu has more 15 years of experience in electronic packaging and is an expert in electronic packaging materials and processing.
Professor C.P. Wong is with the School of Materials Sciences and Engineering at Georgia Tech (GT) and also is the Dean of Engineering, The Chinese University of Hong Kong. Prior to joining GT, he was with AT&T Bell Laboratories for many years and was an AT&T Bell Labs Fellow. His research interests focus on the areas of material and process for electronic, photonic, MEMS, sensors, and energy harvesting and storage. He has published over 1,000 technical papers, 12 books and holds over 65 US Patents. He is a member of the US National Academy of Engineering and a Foreign Academician of the Chinese Academy of Engineering.
Provides a comprehensive summary of the most recent advances in materials development for advanced packaging
Covers emerging technologies such as digital health, bio-medical and nano materials and process, and microelectronic and optoelectronic packaging
Contains a balanced number of chapter authors from academia and industry, who are leaders in their respective fields
Erscheinungsjahr: | 2018 |
---|---|
Fachbereich: | Nachrichtentechnik |
Genre: | Technik |
Rubrik: | Naturwissenschaften & Technik |
Medium: | Taschenbuch |
Inhalt: |
xvi
969 S. 260 s/w Illustr. 440 farbige Illustr. 969 p. 700 illus. 440 illus. in color. |
ISBN-13: | 9783319832098 |
ISBN-10: | 3319832093 |
Sprache: | Englisch |
Ausstattung / Beilage: | Paperback |
Einband: | Kartoniert / Broschiert |
Redaktion: |
Wong, C. P.
Lu, Daniel |
Herausgeber: | Daniel Lu/C P Wong |
Auflage: | Softcover reprint of the original 2nd ed. 2017 |
Hersteller: |
Springer International Publishing
Springer International Publishing AG |
Maße: | 235 x 155 x 53 mm |
Von/Mit: | C. P. Wong (u. a.) |
Erscheinungsdatum: | 08.06.2018 |
Gewicht: | 1,463 kg |