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Riko Radojcic is an independent consultant specialized in 2.5D and 3D integration technologies, DfX process-design integration techniques, and advanced technology management.
Most recently, he was a Senior Director of Technology at Qualcomm Technologies Inc. where he led the 2.5D and 3D Technology Integration team, addressing all aspects of advanced integration options, ranging from architecture down to manufacturability. In the previous years with Qualcomm, Riko has led a number of Design-for-Technology initiatives, including Design-for-3D, Design-for-Thermal, Design-for-Stress, Design-for-Variability, Design-for-Manufacturability, etc.
Radojcic has more than thirty years' experience in the semiconductor industry, and has specialized in integration of process technology and design considerations. Before joining Qualcomm, he was an independent consultant to semiconductor and EDA companies providing engineering and business development services. Before that, he focused on design technology, process characterization and modeling integration, with PDF Solutions (director of marketing), Tality Corporation (Business Manager) and Cadence (architect). Radojcic has held a series of managerial and engineering positions with Unisys and Burroughs, in device engineering, failure analyses and reliability engineering areas. He began his career as a process engineer with Ferranti Electronics, UK.
Radojcic received his BSc and PhD degrees from University of Salford (Manchester), UK.
Based on real, hands-on experiences and presents actual lessons learned;
Describes various aspects of managing an engineering development program;
Explains key technical aspects of semiconductor technology to non-experts;
Written in a novelized form that makes it very easy to read;
Enables an understanding of how and why the chip industry evolved over the last 50 years into what it is today.
| Erscheinungsjahr: | 2019 |
|---|---|
| Fachbereich: | Nachrichtentechnik |
| Genre: | Technik |
| Rubrik: | Naturwissenschaften & Technik |
| Medium: | Taschenbuch |
| Seiten: | 224 |
| Inhalt: |
x
211 S. 4 s/w Illustr. 63 farbige Illustr. 211 p. 67 illus. 63 illus. in color. |
| ISBN-13: | 9783030064952 |
| ISBN-10: | 3030064956 |
| Sprache: | Englisch |
| Ausstattung / Beilage: | Paperback |
| Einband: | Kartoniert / Broschiert |
| Autor: | Radojcic, Riko |
| Auflage: | Softcover reprint of the original 1st ed. 2019 |
| Hersteller: |
Springer International Publishing
Springer International Publishing AG |
| Maße: | 235 x 155 x 13 mm |
| Von/Mit: | Riko Radojcic |
| Erscheinungsdatum: | 02.02.2019 |
| Gewicht: | 0,347 kg |
Riko Radojcic is an independent consultant specialized in 2.5D and 3D integration technologies, DfX process-design integration techniques, and advanced technology management.
Most recently, he was a Senior Director of Technology at Qualcomm Technologies Inc. where he led the 2.5D and 3D Technology Integration team, addressing all aspects of advanced integration options, ranging from architecture down to manufacturability. In the previous years with Qualcomm, Riko has led a number of Design-for-Technology initiatives, including Design-for-3D, Design-for-Thermal, Design-for-Stress, Design-for-Variability, Design-for-Manufacturability, etc.
Radojcic has more than thirty years' experience in the semiconductor industry, and has specialized in integration of process technology and design considerations. Before joining Qualcomm, he was an independent consultant to semiconductor and EDA companies providing engineering and business development services. Before that, he focused on design technology, process characterization and modeling integration, with PDF Solutions (director of marketing), Tality Corporation (Business Manager) and Cadence (architect). Radojcic has held a series of managerial and engineering positions with Unisys and Burroughs, in device engineering, failure analyses and reliability engineering areas. He began his career as a process engineer with Ferranti Electronics, UK.
Radojcic received his BSc and PhD degrees from University of Salford (Manchester), UK.
Based on real, hands-on experiences and presents actual lessons learned;
Describes various aspects of managing an engineering development program;
Explains key technical aspects of semiconductor technology to non-experts;
Written in a novelized form that makes it very easy to read;
Enables an understanding of how and why the chip industry evolved over the last 50 years into what it is today.
| Erscheinungsjahr: | 2019 |
|---|---|
| Fachbereich: | Nachrichtentechnik |
| Genre: | Technik |
| Rubrik: | Naturwissenschaften & Technik |
| Medium: | Taschenbuch |
| Seiten: | 224 |
| Inhalt: |
x
211 S. 4 s/w Illustr. 63 farbige Illustr. 211 p. 67 illus. 63 illus. in color. |
| ISBN-13: | 9783030064952 |
| ISBN-10: | 3030064956 |
| Sprache: | Englisch |
| Ausstattung / Beilage: | Paperback |
| Einband: | Kartoniert / Broschiert |
| Autor: | Radojcic, Riko |
| Auflage: | Softcover reprint of the original 1st ed. 2019 |
| Hersteller: |
Springer International Publishing
Springer International Publishing AG |
| Maße: | 235 x 155 x 13 mm |
| Von/Mit: | Riko Radojcic |
| Erscheinungsdatum: | 02.02.2019 |
| Gewicht: | 0,347 kg |
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