CFD Analysis of Heat Transfer problems

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Sprache: Englisch

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Beschreibung

Simulation of heat transfer problems is of very much essential in the design and manufacturing of systems. The heat transfer problems involves the estimation of thermal stresses, contours describing the location of weak sections of a body. The simulation of the thermal stresses will minimize the design and manufacturing cost. Heat transfer problems related to conduction, convection and radiation are simulated using ANSYS FLUENT software. The step by step procedure of modeling and simulation is described in the book. The readers will get the ease of modeling and simulation of heat transfer problems and will find a platform for advanced simulations.

Über den Autor

[...].Srinivasa Rao, is presently working as a Professor of Mechanical Engineering in Kallam Haranadhareddy Institute of Technology, Chowdavaram, Guntur, Andhra Pradesh, INDIA. He has 22 years of teaching experience. He has published more than 50 research papers in reputed journals of national and international. He was a life time member of ISTE.

Erscheinungsjahr:	2021
Fachbereich:	Fertigungstechnik
Genre:	Importe , Technik
Rubrik:	Naturwissenschaften & Technik
Medium:	Taschenbuch
ISBN-13:	9786203857481
ISBN-10:	6203857483
Sprache:	Englisch
Einband:	Kartoniert / Broschiert
Autor:	Srinivasa Rao, Chepuri
Hersteller:	LAP LAMBERT Academic Publishing
Verantwortliche Person für die EU:	LAP Lambert Academic Publishing, Brivibas Gatve 197, ?-1039 Riga, customerservice@vdm-vsg.de
Maße:	220 x 150 x 4 mm
Von/Mit:	Chepuri Srinivasa Rao
Erscheinungsdatum:	11.05.2021
Gewicht:	0,096 kg