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Arbitrary Modeling of TSVs for 3D Integrated Circuits
Buch von Khaled Salah (u. a.)
Sprache: Englisch

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Beschreibung
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Zusammenfassung

Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region

Enables readers to use a model which is technology dependent and can be used for any TSV configuration

Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors

Equips readers for fast parasitic extraction of TSVs for 3D IC design

Includes supplementary material: [...]

Inhaltsverzeichnis

Introduction: Work around Moore's Law.- 3D/TSV Enabling Technologies.- TSV Modeling and Analysis.- TSV Verification.- TSV Macro-Modeling Framework.- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter.- Imperfection in TSV Modeling.- New Trends in TSV.- TSV Fabrication.- Conclusions.

Details
Erscheinungsjahr: 2014
Fachbereich: Nachrichtentechnik
Genre: Mathematik, Medizin, Naturwissenschaften, Technik
Rubrik: Naturwissenschaften & Technik
Medium: Buch
Inhalt: ix
179 S.
60 s/w Illustr.
99 farbige Illustr.
179 p. 159 illus.
99 illus. in color.
ISBN-13: 9783319076102
ISBN-10: 3319076108
Sprache: Englisch
Herstellernummer: 86232002
Einband: Gebunden
Autor: Salah, Khaled
El-Rouby, Alaa
Ismail, Yehea
Hersteller: Springer International Publishing
Springer International Publishing AG
Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com
Maße: 241 x 160 x 15 mm
Von/Mit: Khaled Salah (u. a.)
Erscheinungsdatum: 05.09.2014
Gewicht: 0,459 kg
Artikel-ID: 105216358
Zusammenfassung

Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region

Enables readers to use a model which is technology dependent and can be used for any TSV configuration

Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors

Equips readers for fast parasitic extraction of TSVs for 3D IC design

Includes supplementary material: [...]

Inhaltsverzeichnis

Introduction: Work around Moore's Law.- 3D/TSV Enabling Technologies.- TSV Modeling and Analysis.- TSV Verification.- TSV Macro-Modeling Framework.- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter.- Imperfection in TSV Modeling.- New Trends in TSV.- TSV Fabrication.- Conclusions.

Details
Erscheinungsjahr: 2014
Fachbereich: Nachrichtentechnik
Genre: Mathematik, Medizin, Naturwissenschaften, Technik
Rubrik: Naturwissenschaften & Technik
Medium: Buch
Inhalt: ix
179 S.
60 s/w Illustr.
99 farbige Illustr.
179 p. 159 illus.
99 illus. in color.
ISBN-13: 9783319076102
ISBN-10: 3319076108
Sprache: Englisch
Herstellernummer: 86232002
Einband: Gebunden
Autor: Salah, Khaled
El-Rouby, Alaa
Ismail, Yehea
Hersteller: Springer International Publishing
Springer International Publishing AG
Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com
Maße: 241 x 160 x 15 mm
Von/Mit: Khaled Salah (u. a.)
Erscheinungsdatum: 05.09.2014
Gewicht: 0,459 kg
Artikel-ID: 105216358
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