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Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region
Enables readers to use a model which is technology dependent and can be used for any TSV configuration
Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors
Equips readers for fast parasitic extraction of TSVs for 3D IC design
Includes supplementary material: [...]
Introduction: Work around Moore's Law.- 3D/TSV Enabling Technologies.- TSV Modeling and Analysis.- TSV Verification.- TSV Macro-Modeling Framework.- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter.- Imperfection in TSV Modeling.- New Trends in TSV.- TSV Fabrication.- Conclusions.
| Erscheinungsjahr: | 2014 |
|---|---|
| Fachbereich: | Nachrichtentechnik |
| Genre: | Mathematik, Medizin, Naturwissenschaften, Technik |
| Rubrik: | Naturwissenschaften & Technik |
| Medium: | Buch |
| Inhalt: |
ix
179 S. 60 s/w Illustr. 99 farbige Illustr. 179 p. 159 illus. 99 illus. in color. |
| ISBN-13: | 9783319076102 |
| ISBN-10: | 3319076108 |
| Sprache: | Englisch |
| Herstellernummer: | 86232002 |
| Einband: | Gebunden |
| Autor: |
Salah, Khaled
El-Rouby, Alaa Ismail, Yehea |
| Hersteller: |
Springer International Publishing
Springer International Publishing AG |
| Verantwortliche Person für die EU: | Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com |
| Maße: | 241 x 160 x 15 mm |
| Von/Mit: | Khaled Salah (u. a.) |
| Erscheinungsdatum: | 05.09.2014 |
| Gewicht: | 0,459 kg |
Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region
Enables readers to use a model which is technology dependent and can be used for any TSV configuration
Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors
Equips readers for fast parasitic extraction of TSVs for 3D IC design
Includes supplementary material: [...]
Introduction: Work around Moore's Law.- 3D/TSV Enabling Technologies.- TSV Modeling and Analysis.- TSV Verification.- TSV Macro-Modeling Framework.- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter.- Imperfection in TSV Modeling.- New Trends in TSV.- TSV Fabrication.- Conclusions.
| Erscheinungsjahr: | 2014 |
|---|---|
| Fachbereich: | Nachrichtentechnik |
| Genre: | Mathematik, Medizin, Naturwissenschaften, Technik |
| Rubrik: | Naturwissenschaften & Technik |
| Medium: | Buch |
| Inhalt: |
ix
179 S. 60 s/w Illustr. 99 farbige Illustr. 179 p. 159 illus. 99 illus. in color. |
| ISBN-13: | 9783319076102 |
| ISBN-10: | 3319076108 |
| Sprache: | Englisch |
| Herstellernummer: | 86232002 |
| Einband: | Gebunden |
| Autor: |
Salah, Khaled
El-Rouby, Alaa Ismail, Yehea |
| Hersteller: |
Springer International Publishing
Springer International Publishing AG |
| Verantwortliche Person für die EU: | Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com |
| Maße: | 241 x 160 x 15 mm |
| Von/Mit: | Khaled Salah (u. a.) |
| Erscheinungsdatum: | 05.09.2014 |
| Gewicht: | 0,459 kg |
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