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Cover: 9780081020944 | Wide Bandgap Power Semiconductor Packaging | Katsuaki Suganuma | Buch
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Wide Bandgap Power Semiconductor Packaging
Materials, Components, and Reliability
Taschenbuch von Katsuaki Suganuma
Sprache: Englisch

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Beschreibung
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration.

As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration.

As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.

Inhaltsverzeichnis

Part 1 Fundamentals and Materials 1. Introduction 2. Interconnect Technologies 3. Substrates

Part 2 Components 4. Magnetic materials

Part 3 Performance Measurement and Reliability Evaluation 5. Cooling System: Al and Cu Cooling Systems 6. Thermal Transient Testing 7. Reliability Evaluation 8. CAE Simulation

Part 4 Future Prospects 9. Future Solutions

Details
Genre: Technik
Rubrik: Naturwissenschaften & Technik
Medium: Taschenbuch
ISBN-13: 9780081020944
ISBN-10: 0081020945
Sprache: Englisch
Herstellernummer: C2016-0-02345-8
Redaktion: Suganuma, Katsuaki
Hersteller: Woodhead Publishing
Elsevier Science & Technology
Maße: 11 x 152 x 229 mm
Von/Mit: Katsuaki Suganuma
Gewicht: 0,4 kg
Artikel-ID: 126704500
Inhaltsverzeichnis

Part 1 Fundamentals and Materials 1. Introduction 2. Interconnect Technologies 3. Substrates

Part 2 Components 4. Magnetic materials

Part 3 Performance Measurement and Reliability Evaluation 5. Cooling System: Al and Cu Cooling Systems 6. Thermal Transient Testing 7. Reliability Evaluation 8. CAE Simulation

Part 4 Future Prospects 9. Future Solutions

Details
Genre: Technik
Rubrik: Naturwissenschaften & Technik
Medium: Taschenbuch
ISBN-13: 9780081020944
ISBN-10: 0081020945
Sprache: Englisch
Herstellernummer: C2016-0-02345-8
Redaktion: Suganuma, Katsuaki
Hersteller: Woodhead Publishing
Elsevier Science & Technology
Maße: 11 x 152 x 229 mm
Von/Mit: Katsuaki Suganuma
Gewicht: 0,4 kg
Artikel-ID: 126704500
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