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J.W. McPherson is recognized internationally as an expert in Reliability Physics & Engineering. He has published over 200 papers on reliability, authored the Reliability Chapters for 4 Books, awarded 15 patents, and holds the title of Texas Instruments Senior Fellow Emeritus. He was the 1995 General Chairman of the IEEE International Reliability Physics Symposium and still serves on its Board of Directors. In 2004, Joe received the IEEE Engineer of the Year Award from the Texas Society of Professional Engineers. In 2006, he was the Chairman of the International Sematech Reliability Council. Joe is an IEEE Fellow and the Founder/CEO of McPherson Reliability Consulting, LLC. His semiconductor reliability expertise includes device-physics, design-in reliability, wafer-fabrication and assembly-related reliability issues. Several of the reliability models that are used today in the semiconductor industry are closely associated with his name.
Provides comprehensive textbook on reliability physics of semiconductors, from fundamentals to applications
Explains the fundamentals of reliability physics and engineering tools for building better products
Contains statistical training and tools within the text
Includes new chapters on Physics of Degradation, and Resonance and Resonance-Induced Degradation.
Introduction.- Physics of Degradation.- Time Dependence of Materials and Device Degradation.- From Material/Device Degradation to Time-To-Failure.- Time-To-Failure Modeling.- Gaussian Statistics - An Overview.- Time-To-Failure Statistics.- Failure Rate Modeling.- Accelerated Degradation.- Acceleration Factor Modeling.- Ramp-To-Failure Testing.- Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits.- Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering.- Conversion of Dynamical Stresses Into Effective Static Values.- Resonance and Resonance-Induced Degradation.- Increasing the Reliability of Device/Product Designs.- Screening.- Heat Generation and Dissipation.- Sampling Plans and Confidence Intervals.-
| Erscheinungsjahr: | 2019 |
|---|---|
| Fachbereich: | Fertigungstechnik |
| Genre: | Technik |
| Rubrik: | Naturwissenschaften & Technik |
| Medium: | Buch |
| Seiten: | 484 |
| Inhalt: |
xvii
463 S. 43 s/w Illustr. 164 farbige Illustr. 463 p. 207 illus. 164 illus. in color. |
| ISBN-13: | 9783319936826 |
| ISBN-10: | 3319936824 |
| Sprache: | Englisch |
| Herstellernummer: | 978-3-319-93682-6 |
| Ausstattung / Beilage: | HC runder Rücken kaschiert |
| Einband: | Gebunden |
| Autor: | McPherson, J. W. |
| Auflage: | 3rd ed. 2019 |
| Hersteller: |
Springer International Publishing
Springer International Publishing AG |
| Maße: | 241 x 160 x 32 mm |
| Von/Mit: | J. W. McPherson |
| Erscheinungsdatum: | 10.01.2019 |
| Gewicht: | 0,887 kg |
J.W. McPherson is recognized internationally as an expert in Reliability Physics & Engineering. He has published over 200 papers on reliability, authored the Reliability Chapters for 4 Books, awarded 15 patents, and holds the title of Texas Instruments Senior Fellow Emeritus. He was the 1995 General Chairman of the IEEE International Reliability Physics Symposium and still serves on its Board of Directors. In 2004, Joe received the IEEE Engineer of the Year Award from the Texas Society of Professional Engineers. In 2006, he was the Chairman of the International Sematech Reliability Council. Joe is an IEEE Fellow and the Founder/CEO of McPherson Reliability Consulting, LLC. His semiconductor reliability expertise includes device-physics, design-in reliability, wafer-fabrication and assembly-related reliability issues. Several of the reliability models that are used today in the semiconductor industry are closely associated with his name.
Provides comprehensive textbook on reliability physics of semiconductors, from fundamentals to applications
Explains the fundamentals of reliability physics and engineering tools for building better products
Contains statistical training and tools within the text
Includes new chapters on Physics of Degradation, and Resonance and Resonance-Induced Degradation.
Introduction.- Physics of Degradation.- Time Dependence of Materials and Device Degradation.- From Material/Device Degradation to Time-To-Failure.- Time-To-Failure Modeling.- Gaussian Statistics - An Overview.- Time-To-Failure Statistics.- Failure Rate Modeling.- Accelerated Degradation.- Acceleration Factor Modeling.- Ramp-To-Failure Testing.- Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits.- Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering.- Conversion of Dynamical Stresses Into Effective Static Values.- Resonance and Resonance-Induced Degradation.- Increasing the Reliability of Device/Product Designs.- Screening.- Heat Generation and Dissipation.- Sampling Plans and Confidence Intervals.-
| Erscheinungsjahr: | 2019 |
|---|---|
| Fachbereich: | Fertigungstechnik |
| Genre: | Technik |
| Rubrik: | Naturwissenschaften & Technik |
| Medium: | Buch |
| Seiten: | 484 |
| Inhalt: |
xvii
463 S. 43 s/w Illustr. 164 farbige Illustr. 463 p. 207 illus. 164 illus. in color. |
| ISBN-13: | 9783319936826 |
| ISBN-10: | 3319936824 |
| Sprache: | Englisch |
| Herstellernummer: | 978-3-319-93682-6 |
| Ausstattung / Beilage: | HC runder Rücken kaschiert |
| Einband: | Gebunden |
| Autor: | McPherson, J. W. |
| Auflage: | 3rd ed. 2019 |
| Hersteller: |
Springer International Publishing
Springer International Publishing AG |
| Maße: | 241 x 160 x 32 mm |
| Von/Mit: | J. W. McPherson |
| Erscheinungsdatum: | 10.01.2019 |
| Gewicht: | 0,887 kg |
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