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This book explains how to carry out reliable SMD assembly using affordable tools and small-scale equipment. It follows the complete workflow step by step, including tool selection, solder paste handling, stencil use, component placement, reflow methods, inspection, and rework.
The focus is on bench-level and small-lab production rather than industrial assembly lines. It shows practical methods for building single and double-sided SMD boards with repeatable results.
Topics include solder paste and flux, temperature profiles, hot air and hotplate techniques, small reflow ovens, inspection methods, and defect correction. Checklists and example workflows are included to help reduce errors and improve consistency.
Key features:
- Tools and supplies for SMD assembly and rework
- Solder paste types, storage, and handling
- Stencils and paste application methods
- Pick and place workflow and component orientation
- Temperature profiles and reflow methods
- Hot air, hotplate, and reflow oven processes
- Inspection and quality control
- Common defects such as tombstoning and solder bridges
- Practical rework and component replacement
- Bench-level professional workflows and checklists
This book is designed as a practical bench reference for anyone who wants to assemble and troubleshoot their own SMD boards with reliable results.
This book explains how to carry out reliable SMD assembly using affordable tools and small-scale equipment. It follows the complete workflow step by step, including tool selection, solder paste handling, stencil use, component placement, reflow methods, inspection, and rework.
The focus is on bench-level and small-lab production rather than industrial assembly lines. It shows practical methods for building single and double-sided SMD boards with repeatable results.
Topics include solder paste and flux, temperature profiles, hot air and hotplate techniques, small reflow ovens, inspection methods, and defect correction. Checklists and example workflows are included to help reduce errors and improve consistency.
Key features:
- Tools and supplies for SMD assembly and rework
- Solder paste types, storage, and handling
- Stencils and paste application methods
- Pick and place workflow and component orientation
- Temperature profiles and reflow methods
- Hot air, hotplate, and reflow oven processes
- Inspection and quality control
- Common defects such as tombstoning and solder bridges
- Practical rework and component replacement
- Bench-level professional workflows and checklists
This book is designed as a practical bench reference for anyone who wants to assemble and troubleshoot their own SMD boards with reliable results.
| Erscheinungsjahr: | 2026 |
|---|---|
| Fachbereich: | Nachrichtentechnik |
| Genre: | Mathematik, Medizin, Naturwissenschaften, Technik |
| Rubrik: | Naturwissenschaften & Technik |
| Medium: | Taschenbuch |
| Inhalt: | 144 S. |
| ISBN-13: | 9783895767289 |
| ISBN-10: | 389576728X |
| Sprache: | Englisch |
| Herstellernummer: | 21299 |
| Einband: | Klappenbroschur |
| Autor: | Rudman, Paul |
| Hersteller: |
Elektor Verlag
Elektor Verlag GmbH |
| Verantwortliche Person für die EU: | Elektor Verlag GmbH, Roel Willems, Lukasstr. 1, D-52070 Aachen, roel.willems@elektor.com |
| Maße: | 170 x 239 x 10 mm |
| Von/Mit: | Paul Rudman |
| Erscheinungsdatum: | 04.05.2026 |
| Gewicht: | 0,288 kg |
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