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Cover: 9781489991164 | Lead Free Solder | Mechanics and Reliability | John Hock Lye Pang | x
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Lead Free Solder
Mechanics and Reliability
Taschenbuch von John Hock Lye Pang
Sprache: Englisch

102,95 €*

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Lieferzeit 4-7 Werktage

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Beschreibung
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
Zusammenfassung

Discusses lead-free solder materials industry their selection and how they are currently used industry wide

Focuses on mechanics of materials theory in elastic, plastic, creep, fatigue and fracture assessments

Presents materials testing and characterization at the macro, micro, and nano scale

Details how to use reliability test and analysis for thermal cycling, cyclic bending and drop impact

Includes supplementary material: [...]

Inhaltsverzeichnis

Introduction.-Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models.- Fatigue Life Prediction Models.- Finite Element Analysis and Design-For-Reliability.- Thermo-Mechanical Reliability Test and Analysis.- Dynamic Mechanical Reliability Test and Analysis.- Thermal Cycling Aging Effects on Board-Level Drop Test Result

Details
Erscheinungsjahr: 2014
Fachbereich: Nachrichtentechnik
Genre: Technik
Rubrik: Naturwissenschaften & Technik
Medium: Taschenbuch
Seiten: 188
Inhalt: x
175 S.
162 s/w Illustr.
175 p. 162 illus.
ISBN-13: 9781489991164
ISBN-10: 1489991166
Sprache: Englisch
Ausstattung / Beilage: Paperback
Einband: Kartoniert / Broschiert
Autor: Pang, John Hock Lye
Auflage: 2012
Hersteller: Springer US
Springer New York
Maße: 235 x 155 x 11 mm
Von/Mit: John Hock Lye Pang
Erscheinungsdatum: 30.10.2014
Gewicht: 0,295 kg
preigu-id: 105027380
Zusammenfassung

Discusses lead-free solder materials industry their selection and how they are currently used industry wide

Focuses on mechanics of materials theory in elastic, plastic, creep, fatigue and fracture assessments

Presents materials testing and characterization at the macro, micro, and nano scale

Details how to use reliability test and analysis for thermal cycling, cyclic bending and drop impact

Includes supplementary material: [...]

Inhaltsverzeichnis

Introduction.-Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models.- Fatigue Life Prediction Models.- Finite Element Analysis and Design-For-Reliability.- Thermo-Mechanical Reliability Test and Analysis.- Dynamic Mechanical Reliability Test and Analysis.- Thermal Cycling Aging Effects on Board-Level Drop Test Result

Details
Erscheinungsjahr: 2014
Fachbereich: Nachrichtentechnik
Genre: Technik
Rubrik: Naturwissenschaften & Technik
Medium: Taschenbuch
Seiten: 188
Inhalt: x
175 S.
162 s/w Illustr.
175 p. 162 illus.
ISBN-13: 9781489991164
ISBN-10: 1489991166
Sprache: Englisch
Ausstattung / Beilage: Paperback
Einband: Kartoniert / Broschiert
Autor: Pang, John Hock Lye
Auflage: 2012
Hersteller: Springer US
Springer New York
Maße: 235 x 155 x 11 mm
Von/Mit: John Hock Lye Pang
Erscheinungsdatum: 30.10.2014
Gewicht: 0,295 kg
preigu-id: 105027380
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