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Brian Rowe is considered the father of centerless grinding in addition to other notable research on grinding that includes thermal aspects, dynamic aspects, and fluid-film bearings. He established a laboratory and school dedicated to manufacturing processes at Liverpool John Moores University and is an Emeritus Professor.
Ichiro Inasaki Eckart Uhlmann Dr. Mike Hitchiner
THE BASIC PROCESS OF GRINDING. Introduction. Grinding Parameters. Material Removal Mechanisms. Grinding Wheels. The Nature of the Abrasive. Specification of the Bond. Dressing. Grinding Dynamics. Grinding Wheel Wear. Coolants, the Coolant System, and Cooling. Monitoring of Grinding Processes. Economics of Grinding. APPLICATION OF GRINDING PROCESSES. Grinding of Ductile Materials. Grinding of Ceramics. Grinding Machine Technology. Surface Grinding. External Cylindrical Grinding. Internal Grinding. Centerless Grinding. Ultrasonic-Assisted Grinding. Glossary. Appendix: Notation and Use of SI Units.
| Erscheinungsjahr: | 2019 |
|---|---|
| Fachbereich: | Mechanik & Akustik |
| Genre: | Importe, Physik |
| Rubrik: | Naturwissenschaften & Technik |
| Medium: | Taschenbuch |
| Inhalt: | Einband - flex.(Paperback) |
| ISBN-13: | 9780367868703 |
| ISBN-10: | 0367868709 |
| Sprache: | Englisch |
| Einband: | Kartoniert / Broschiert |
| Autor: |
Marinescu, Ioan D.
Hitchiner, Mike P. Uhlmann, Eckart |
| Auflage: | 2. Auflage |
| Hersteller: | CRC Press |
| Verantwortliche Person für die EU: | Libri GmbH, Europaallee 1, D-36244 Bad Hersfeld, gpsr@libri.de |
| Maße: | 254 x 178 x 41 mm |
| Von/Mit: | Ioan D. Marinescu (u. a.) |
| Erscheinungsdatum: | 13.12.2019 |
| Gewicht: | 1,388 kg |