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Beschreibung
This book presents physical understanding, modeling and simulation, on-chip characterization, layout solutions, and design techniques that are effective to enhance the reliability of various circuit units. The authors provide readers with techniques for state of the art and future technologies, ranging from technology modeling, fault detection and analysis, circuit hardening, and reliability management.
This book presents physical understanding, modeling and simulation, on-chip characterization, layout solutions, and design techniques that are effective to enhance the reliability of various circuit units. The authors provide readers with techniques for state of the art and future technologies, ranging from technology modeling, fault detection and analysis, circuit hardening, and reliability management.
Zusammenfassung

Provides comprehensive review on various reliability mechanisms at sub-45nm nodes

Describes practical modeling and characterization techniques for reliability

Includes thorough presentation of robust design techniques for major VLSI design units

Promotes physical understanding with first-principle simulations

Includes supplementary material: [...]

Inhaltsverzeichnis
Introduction.- Recent Trends in Bias Temperature Instability.- Charge trapping phenomena in MOSFETS: From Noise to Bias Temperature Instability.- Atomistic Simulations on Reliability.- On-chip characterization of statistical device degradation.- Circuit Resilience Roadmap.- Layout Aware Electromigration Analysis of Power/Ground Networks.- Power-Gating for Leakage Control and Beyond.- Soft Error Rate and Fault Tolerance Techniques for FPGAs.- Low Power Robust FinFET-based SRAM Design in Scaled Technologies.- Variability-Aware Clock Design.
Details
Erscheinungsjahr: 2016
Fachbereich: Nachrichtentechnik
Genre: Importe, Technik
Rubrik: Naturwissenschaften & Technik
Medium: Taschenbuch
Inhalt: vi
272 S.
58 s/w Illustr.
132 farbige Illustr.
272 p. 190 illus.
132 illus. in color.
ISBN-13: 9781493941568
ISBN-10: 1493941569
Sprache: Englisch
Einband: Kartoniert / Broschiert
Redaktion: Reis, Ricardo
Cao, Yu
Wirth, Gilson
Herausgeber: Ricardo Reis/Yu Cao/Gilson Wirth
Auflage: Softcover reprint of the original 1st edition 2015
Hersteller: Springer
Springer US, New York, N.Y.
Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, D-69121 Heidelberg, juergen.hartmann@springer.com
Maße: 235 x 155 x 15 mm
Von/Mit: Ricardo Reis (u. a.)
Erscheinungsdatum: 22.09.2016
Gewicht: 0,48 kg
Artikel-ID: 103597192