Dr. Douglas H. Morais received a Ph.D from University of Ottawa, Canada, an M.Sc from the University of California, Berkeley, California, and a B.Sc from the University of Edinburgh, Scotland, all in Electrical Engineering. Additionally, he is a Graduate of the AEA/Stanford Executive Institute, Stanford University, California, a Life Senior member of the IEEE Communications Society, and a member of the IEEE Communications Society. After decades in the industry, he is currently a technical book author, short course lecturer, and inventor. Previously, he was President of the Wireless Group at Ortel Corporation and both Executive Vice President, Business Development and Technology and President, Wireless Products Group at California Microwave, Inc. He is the author of "Fixed Broadband Wireless Communications," Pearson Education, Inc., 2004, "5G and Beyond Wireless Transport Technologies," Springer, 2021, and "Key 5G Physical Layer Technologies, Second Edition" Springer, 2022. He has three US patents, including two on digital modulation and one on point-to-multipoint communication.

Shows how smartphones communicate via 5G NR, Wi-Fi 6, and Bluetooth Low Energy 5

Aimed at those wanting a deeper understanding of how smartphone wireless communication works

Conveys at a high level and in a tractable fashion how wireless communication is achieved in smartphones

Chapter 1 5G Nr, Wi-Fi 6, and Bluetooth LE 5 Introduction.- Chapter 2 Data Communications Systems Protocol Stacks.- Chapter 3 The Wireless Path.- Chapter 4 Digital Modulation: The Basic Principles.- Chapter 5 Channel Coding and Link Adaptation.- Chapter 6 Channel Usage Techniques.- Chapter 7 Multiple Antenna Techniques.- Chapter 8 5G NR Overview.- Chapter 9 Wi-Fi 6 Overview.- Chapter 10 Bluetooth LE Overview.